Capacidades rígido-flexibles y flexibles
Cuando usted trabaja con Hemeixincircuito impreso, usted recibe nuestro conocimiento y experiencia, lo que resulta en placas de circuito impreso de alta calidad. Aprenda más sobre nuestras capacidades de circuito impreso rígido-flexible &flex circuito impreso abajo.
| MANUFACTURING | ODB++(preferred) |
|---|---|
| FORMATS | HPGL DXF |
| Gerber 274X | |
| Excellon | |
| MAXIMUM PANEL SIZE | 20″X 80″(500mm X 2000mm) |
| BOARD THICKNESS | min≥2mil(0.05mm) |
| max≤94.5mil(2.4mm), | |
| LAYER COUNT | 2~20 Layer |
| ASPECT RATIO | 16:1 |
| FINISHED HOLE SIZE | 6mil (0.15mm) Mechanical Drill |
| 4mil (0.10mm) Laser Drill | |
| LINE WIDTH/SPACE | 2mil/2mil (Hoz), |
| STIFFENER TYPE | PI stiffener, FR4 stiffener |
| SHIEDING MATERIAL | Shielding film, |
| Silver Based Polymer Thick Film Ink | |
| IMPEDANCE | ±10% |
| SINGLE&DIFFERENTIAL | |
| SURFACE FINISHES | ENIG ENIPIG |
| HASL | |
| OSP Immersion Silver |
