Capacidades de fabricación de placas de circuito impreso

Cuando usted trabaja con Hemeixincircuito impreso, recibe nuestros conocimientos y experiencia, lo que resulta en placas de circuito impreso de alta calidad. Aprenda más sobre nuestras capacidades de circuito impreso HDI y circuito impreso RF abajo.

MANUFACTURING FORMATS	ODB++,HPGL DXF ,Gerber 274X ,Excellon
MAXIMUM PANEL SIZE	48″X 24″(1200mm X 610mm)
MAXIMUM THICKNESS	394 mil(10mm),Samples of 689mil(17.5mm)
LAYER COUNT	2~68 Layer,80+Layer for Samples
INTERCONNECT FORMATION TYPES	Back Drilled Blind (laser & mechanical) Dual Diameter Electrically Isolated Thru Hole Buried SMT
ASPECT RATIO	45 : 1
FINISHED HOLE SIZE	6mil (0.15mm) Mechanical Drill 3mil (0.075mm) Laser Drill
BLIND VIA ASPECT RATIO	1.25 : 1
INTERNAL FEATURES	Inner Layer: 2mil/2mil (Hoz), Outer Layer: 3mil/2mil (Hoz),
EXTERNAL FEATURES	Inner Layer: 2mil/2mil (Hoz), Outer Layer: 3mil/3mil (Hoz) Buried Resistors: Dielectric thickness: 14 μm Capacitance /area: 6.4 nF/in2 Breakdown Voltage: >100V 3M material, no need license Buried Capacitance: Resistance (ohms/sq) : 25, 50, 100, 200
MATERIALS	FR-4, Halogen-Free, Rogers, BT, PTFE, PPO, PPE, Polyimide, Hybrid, Bergquist, Arlon, Taconic and etc.
COPPER PROCESSING	20 oz ,30 oz(Sample)
IMPEDANCE SINGLE&DIFFERENTIAL	±10%,±7.5%,±5%
VIA FILL	Vias filled with LPI/hole fill mask Non-conductive via fill with epoxy hole fill Conductive via fill with copper paste
PRESS FIT	±2mil(0.05mm)
SURFACE FINISHES	Electrolytic Ni/Au (Hard & Soft) ENIG HASL ENIPIG Immersion Silver Immersion Tin Reflowed Tin/Lead OSP

Aquí encontrará un resumen de la fabricación de otros circuito impreso rígidos: ATE circuito impreso, circuito rf

Metal Core & Thermal PCB

Manufacturing Capabilities

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